While many high-tech companies saw their market capitalization drop following the introduction of President Trump's administration import duties, Intel suffered more than many others as its stock price and market capitalization declined to a 16-year low.

Qualcomm expanded its Snapdragon G series with three new gaming chips targeting handheld devices. The trio, consisting of the Snapdragon G3 Gen 3, Snapdragon G2 Gen 2, and Snapdragon G1 Gen 2, will power the next generation of offerings from OEMs, including Ayaneo, OneXPlayer, and Retroid Pocket.

Biwin has introduced two new ultra-high-capacity 192GB (4x48GB) DDR5 memory kits to compete with the best RAM. Targeted at AI developers to boost memory-hungry AI applications, the latest kits, dubbed the Black Opal OC Lab Gold Edition DW100 RGB, are comprised of DDR5-6400 and DDR5-6000 models

AMD just showcased the power of its Strix Halo APU yesterday, but now the company's upcoming desktop X3D chips, the Ryzen 9 9900X3D and the Ryzen 9 9950X3D, have surfaced in a pair of Geekbench 6 benchmarks (h/t @Olrak29).

Intel's next-generation desktop CPU family, codenamed Nova Lake, is officially slated for a 2026 launch. Renowned leaker Jaykihn has weighed in at X, alleging Nova Lake could scale up to 52 cores.

Chinese memory makers are slowly but surely adopting the production of high-bandwidth memory (HBM) for AI and HPC processors. This week, Nikkei reported that a third China-based producer, Tongfu Microelectronics, began sampling its HBM products with select customers.

AMD announced its Ryzen 9000HX series of laptop chips here at CES 2025 in Las Vegas, including its flagship model that it bills as the world’s best mobile processor for gaming and content creation.

It's almost time for CES and as is tradition, Intel and AMD are anticipated to unveil their budget non-K / non-X family of processors in conjunction with affordable motherboards. Hardware data aggregator, momomo_us on X, has shared the box packaging of Intel's Arrow Lake non-K processors, expected to launch next month.

New e-mails from Huawei engineers regarding Linux kernel development suggest that HiSilicon - Huawei's chip subsidiary - is prepping a new Kunpeng SoC with HBM (High Bandwidth Memory) technology - as highlighted by Phoronix. This will likely be the the first significant release from HiSilicon in a while but don't get your hopes up as it could also just be a rebranded older model with a slight pinch of HBM.

Chinese DRAM makers Changxin Memory (CXMT) and Fujian Jinhua are aggressively expanding production and cutting prices, reports DigiTimes. Right now, the two manufacturers sell their DDR4 components with a 50% discount compared to similar ICs made by South Korean makers